Product Overview
About the Meister S+ Semiconductor Solder Inspection System
The Meister S+ extends the Meister S with transparent flux inspection, for advanced packaging lines where flux coverage has to be measured as well as solder. Contact us to arrange a consultation.
Transparent Flux Inspection
Inspects transparent flux using proprietary optics, distinguishing bare pad from flux-on-pad area — a measurement a conventional 2D check cannot make.
Micro Solder at 0.1 Micron
The same 0.1 micron Z resolution and thin-solder capability as the Meister S, down to 20 micron solder thickness on high-density substrates.
Advanced Packaging and Mini/Micro-LED
Built for the same qualified production environments as the rest of the Meister series: semiconductor foundries and Mini/Micro-LED manufacturers.
Meister S+
Combining innovative vision algorithms and high-resolution optic technology, the Meister S/S+ is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement.
Overview
In relation to Koh Young Technology, the overview of semiconductor technology highlights the importance of precision, innovation, and quality control in the production of semiconductor devices. Koh Young’s contributions to this field are centered around its advanced inspection and measurement solutions, which are critical for ensuring the integrity and performance of semiconductor components throughout the fabrication process.
FEATURES
Koh Young Technology leverages its expertise in 3D measurement and inspection to address the unique challenges of semiconductor manufacturing. This includes the precise inspection of wafer surfaces, critical dimension measurement, defect detection, and the analysis of complex structures found in semiconductor devices. These capabilities are essential for identifying potential issues early in the manufacturing process, thereby reducing the risk of costly reworks or failures in the final product.
Semiconductor Metrology
Semiconductor packaging has become one of the most dynamic areas of electronics innovation. From system in package (SiP) and chiplet integration to fan out wafer level packaging (FOWLP) and 3D stacked architectures, new designs are demanding extreme precision in assembly and inspection. Deviations in coplanarity, surface contamination, voids in underfill, or tilted dies can jeopardize signal integrity and mechanical reliability. To succeed in this environment, manufacturers need semiconductor metrology and inspection systems that deliver high resolution, high speed, and comprehensive 3D measurement capabilities, capable of analyzing everything from solder bumps to reflective silicon dies. Learn more about Semiconductor Metrology.
applications
Semiconductor Inspection technology is essential across multiple stages of semiconductor device manufacturing, ensuring the functionality and reliability of electronic products. Key applications include wafer inspection for early defect detection, photolithography process control to ensure accurate circuit patterning, and layer thickness and composition analysis for maintaining electrical properties. Critical dimension measurement is crucial for device performance, while defect review and classification inform decisions on wafer processing. Advanced packaging inspection assesses the integrity of complex packaging techniques, and end-of-line quality assurance confirms the device meets all specifications before shipment. By integrating Semiconductor Inspection technology throughout the manufacturing process, companies can minimize failures, improve yield rates, and ensure high-quality performance in their semiconductor devices, meeting the stringent demands of modern electronics.
BENEFITS
The integration of advanced semiconductor inspection technology, as provided by Koh Young, brings significant benefits to the semiconductor manufacturing process. It enhances product quality by ensuring that devices meet stringent standards, thus reducing the likelihood of failures. This technology also increases manufacturing yield by enabling early defect detection and correction, saving materials and contributing to higher profitability. Additionally, it reduces production costs by minimizing the need for rework or scrapping of defective devices, thereby optimizing resource use. Finally, it supports faster time-to-market for new devices by streamlining the manufacturing process and improving efficiency. Overall, Koh Young’s semiconductor inspection technology is pivotal in meeting the demands for quality, reliability, and efficiency in the fast-paced electronics industry.
- Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Meister S+
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D Solder Paste Inspection solution for the semiconductor & Mini/Micro-LED packaging process improvement. High-resolution optics with a high-speed camera system (0.1 µm Z resolution).
▪ High-resolution optics with a high-speed camera system (0.1 μm Z resolution)
▪ Thin solder inspection down to 20 μm (50 μm diameter @ 3.5 μm, 70 μm diameter @ 5 μm)
▪ Enhanced warpage compensation powered by Koh Young’s differentiated optical technology
(3D Z-tracking with 2D Pad-referencing)
▪ Transparent flux inspection using a proprietary optical system
Our 3D Inspection Technology is allowing customers the flexibility to improve their manufacturing capabilities and output performance.
With over 20+ years of experience the electronics industry, Koh Young offers our customers a wealth of knowledge and expertise.
We believe in putting our customers first no matter what. Our dedicated team are on hand to provide advice and support.
Ai vision
Unparalleled in-house 2D and 3D multi-modal technology combining Moiré technology and new optics enables robust and stable inspection for bleeding-edge applications (such as highly reflective dies and Mini/Micro-LEDs).
With its proprietary deep learning technology, the Meister D/D+ offers enhanced inspection capabilities enabling robust inspection for LED polarity even under harsh production environments such as boards with warp.
Advanced Packaging solutions
The most optimized solution for mass production at major manufacturers of advanced packaging and Mini/Micro-LED applications
Component Inspection
Transports laminates, carriers, strips, boats, and frames.
Powered by AI
Creating a closed-loop, connected electronics manufacturing floor for defect-free production by applying an ever-evolving AI-powered suite of interconnected software modules.
Real-time Koh Young Process Optimizer (KPO)
AI-powered solutions to analyze and optimize the SMT process by examining key parameters generated by state-of-art machine learning technologies.
KPO Printer ensures real-time printing quality without any intervention by an operator or process expert.
KPO Mounter delivers automated root cause analysis and feedback with actionable information.
Koh Young Offline Program Optimizer (OPO)
Cyber-physical system to optimize programs in a simulated environment using the identical machine and actual historical 3D images and measurement data.
Semiconductor Metrology Solutions for Advanced Packaging
Dimensional accuracy, process control, and intelligent feedback are essential pillars of modern semiconductor metrology and inspection.