aSPIre 3

World-Best Performance 3D Solder Paste Inspection

Full 3D data-based process optimization solution:

Our 3D inspection equipment delivers the highest standards in metrology-level True3D SPI. Key features of the aSPIre3 system include:

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0.5 BGA mb-7
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Raising the bar for Solder Paste Inspections systems

Koh Young offers a full range of SPI solutions to handle even the most demanding semiconductor applications. Contact Koh Young America today for details.

Best-in-class Measurement Accuracy and Inspection Reliability