SPI: SOLDER PASTE INSPECTION

Discover the Industry's Highest Performing True3D SPI Solutions

FIND OUT WHY SO MANY MANUFACTURERS IN NORTH AND SOUTH AMERICA RELY ON KOH YOUNG SPI SOLUTIONS

Did you know a majority of printed circuit board (PCB) defects occur during solder printing? Koh Young America’s aSPIre3 system streamlines the solder paste inspection (SPI) process, allowing manufacturers to save time and money without cutting corners.

Raising the bar for Solder Paste Inspections systems

Our 3D inspection equipment delivers the highest standards in metrology-level True3D SPI. Key features of the aSPIre3 system include:

06) aSPIre3_Product Image_Type3_Tilt2_LowRes

Product Lineup

Koh Young offers a full range of SPI solutions to handle even the most demanding semiconductor applications. Contact Koh Young America today for details.

02) KY8030-3_Product Image_Type1_Front_LowRes

8030 Series

01) aSPIre3_Product Image_Type1_Front_HighRes

aSPIre3

Make us your preferred supplier of operational technology in the Americas and beyond.