Discover the Industry’s Highest Performing True3D SPI Solutions
Our 3D inspection equipment incorporates advanced technology like multi-direction moiru00e9 projection and real-time PCB warp compensation for precision. We also leverage our patented AI platform for process optimization. An integrated auto-repair dispensing system can reapply solder paste before the circuit board leaves the machine.
Our portfolio includes a range of advanced inspection technologies designed to enhance manufacturing quality and efficiency. This includes high-performing 3D solder paste inspection equipment and 3D automatic optical inspection (AOI) equipment, enhanced with AI for superior accuracy. Our offerings also cover Dispense Process Inspection (DPI) and Automated Pin Inspection (API) technologies, leveraging sophisticated optics and vision algorithms for precise material application and pin inspection. Additionally, we provide the industry’s first 3D optical measurement instrument tailored for inspecting transparent materials, as well as the leading inspection system for advanced packaging, ensuring comprehensive quality control across various manufacturing processes.
Related reading: Take a deep dive into your SPI process with Neptune | How leading-edge SPI improves production yield | Automated process control for PCB assembly | MiniLED solder paste testing series
Four Constraints Narrow the Range Quickly
Throughput. The KY8030-2 runs from 11.1 to 59.5 cm²/sec. The KY8030-3 is roughly twice as fast as its predecessor, reaching up to 81.85 cm²/sec at 8M and 20 microns, which is where it earns its place on high-volume lines. The aSPIre 3 runs 28.2 to 58.5 cm²/sec in its four-way configuration, or up to 77.9 cm²/sec with the optional two-way.
Component size. This is usually what decides between the 8030 series and the aSPIre 3. The aSPIre 3 supports 03015M components and offers 10 or 15 micron resolution; the KY8030-2 spans 10, 15, 20 and 25 microns with fields of view from 20×20 to 50×50 millimetres, which suits larger deposits and faster coverage.
Paste height. The KY8030-2 measures to 450 microns. The aSPIre 3 reaches 300 microns in its 10 micron configuration and 450 microns at 15 microns, so the resolution choice and the height ceiling are one decision, not two.
Board length. Long boards need the USX configuration of the KY8030-3, which handles up to 1,300 millimetres in a single pass and 1,800 millimetres optionally. A standard-length machine is not a substitute.
If the line runs anything other than ordinary solder paste, check the material list before the speed sheet. The KY8030-3 and aSPIre 3 both support WFMI, conductive glue and sinter paste inspection.
SPI and AOI Catch Different Failures
SPI inspects at the printer, before any component is placed. Most assembly defects originate in paste deposition, and it is the cheapest point in the line to correct one, because the board has not yet accumulated components or a reflow cycle. AOI verifies the finished board after reflow and catches what placement and reflow introduce. Lines running both fix each failure at the stage where it costs least. See our automated optical inspection equipment for that half of the process.
Choosing a solder paste inspection machine comes down to what the printer is being asked to do. A line placing 03015M parts at high volume and a line building tall paste deposits on mixed, short runs need different machines, and the difference is throughput, resolution and paste height range rather than quality tiers.
Every system below measures paste height, area and volume rather than judging a 2D image, which means the output is a set of numbers each deposit can be tolerance-checked against instead of a pass or fail opinion. All three hold Z resolution of 0.37 microns and height accuracy of 1 micron, with Gage R&R under 10 percent at 6 sigma. Our introduction to solder paste inspection covers how that measurement works.
The three systems below cover high-volume SMT lines, metrology-grade inspection and long-board assembly.
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