SPI: Solder Paste Inspection Koh Young America

SPI: SOLDER PASTE INSPECTION

Discover the Industry's Highest Performing True3D SPI Solutions

FIND OUT WHY SO MANY MANUFACTURERS IN NORTH AND SOUTH AMERICA RELY ON KOH YOUNG SPI SOLUTIONS

Did you know a majority of printed circuit board (PCB) defects occur during solder printing? Koh Young America’s aSPIre3 system streamlines the solder paste inspection (SPI) process, allowing manufacturers to save time and money without cutting corners.

Award-winning Inspection Accuracy and Reliability

Guranteed True3D Accuracy meets Production Rates

Best-in-class Accuracy with Production Speeds

Raising the bar for Solder Paste Inspections systems

Our 3D inspection equipment delivers the highest standards in metrology-level True3D SPI. Key features of the aSPIre3 system include:

Incomparable True3D Inspection Performance

IPC-based Solder Joint Inspection

Active Warp Compensation

AI-powered Auto Programming (KAP)

Enhanced 3D measurement using proprietary AI technology

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Product Lineup

Koh Young offers a full range of SPI solutions to handle even the most demanding semiconductor applications. Contact Koh Young America today for details.