Product Overview
About the KY8030-2 SPI System
The KY8030-2 is Koh Young’s most widely deployed 3D solder paste inspection system, measuring paste height, area and volume from 11.1 to 59.5 cm²/sec. Contact us to arrange a consultation.
Speed and Coverage
Inspection from 11.1 to 59.5 cm²/sec, with fields of view from 20x20 to 50x50 millimetres and resolutions of 10, 15, 20 or 25 microns. Available in M, L and XL formats.
Metrology-Grade Repeatability
Z resolution of 0.37 microns and height accuracy of 1 micron, with Gage R&R under 10 percent at 6 sigma against a ±50 percent tolerance — output usable for statistical process control.
Paste to 450 Microns
Maximum paste height of 450 microns covers standard SMT deposits through to the taller prints used for connectors and shielding.
8030 Series
The 8030 has maintained the industry’s leading position as the best-selling True 3D Solder Paste Inspection System since entering the market. Combining Koh Young’s patented 3D dual-inspection Moiré projection technology, it effectively eliminates critical shadow and specular reflection challenges other 3D inspection systems simply cannot address.
Overview
Our 3D solder paste inspection equipment features the world’s leading measurement accuracy and inspection reliability.Accurate measurement data can be secured and the optimization of printing process can be realized through Koh Young’s patented technology that solves shadow and diffuse problems.
FEATURES
Our solder paste inspection equipment sets the gold standard with best-in-class measurement accuracy and inspection reliability, featuring active warp compensation and automated solder paste dispensing with auto-rework capabilities. It’s underpinned by a true 3D measurement-based process control system and leverages AI-powered KPO for zero-defect production, ensuring the highest standard in metrology-level 3D inspection. Going beyond traditional solder paste inspection, it includes self-diagnosis for optimal performance maintenance, marking a new era in precision and efficiency.
solder paste inspection
Solder Paste Inspection (SPI) is a critical process in the manufacturing of printed circuit boards (PCBs) and other electronic assemblies. This process involves the use of specialized equipment to inspect and verify the quality of solder paste application on PCBs before the placement of electronic components. Did you know a majority of printed circuit board (PCB) defects occur during solder printing? Koh Young America’s aSPIre3 system streamlines the solder paste inspection (SPI) process, allowing manufacturers to save time and money without cutting corners.
SOLUTIONS
Our 3D solder paste inspection equipment features the world’s leading measurement accuracy and inspection reliability. Accurate measurement data can be secured and the optimization of printing process can be realized through Koh Young’s patented technology that solves shadow and diffuse problems.
applications
Solder Paste Inspection plays a crucial role across the electronics manufacturing industry, serving as a key process to ensure the quality and reliability of printed circuit boards (PCBs). By meticulously examining the application of solder paste—a critical step in the PCB assembly process—this inspection identifies defects such as insufficient or excessive solder, misalignment, and shape discrepancies. Addressing these issues early in the manufacturing process is essential for preventing potential faults in electronic devices, ranging from consumer electronics to advanced medical equipment and aerospace components. Ultimately, solder paste inspection underpins the assembly’s precision and functionality, contributing significantly to the overall performance and longevity of a wide array of electronic products.
BENEFITS
Investing in solder paste inspection brings a myriad of benefits crucial for the success of electronics manufacturing, encapsulating enhanced product quality and reliability as its core advantage. By identifying and rectifying solder paste application errors early, it ensures that printed circuit boards (PCBs) are less likely to fail, thereby upholding stringent quality standards. This scrutiny not only streamlines the manufacturing process by reducing the necessity for rework and manual inspection but also leads to significant cost savings by minimizing product failures and recalls. Moreover, the assurance of high-quality, reliable products bolsters customer satisfaction and strengthens brand reputation, potentially increasing market share. The scalability of advanced inspection systems accommodates high-volume production needs, ensuring efficiency and adaptability. Additionally, the integration of sophisticated analytics within these systems provides invaluable data for continuous process improvement and innovation, aligning with industry standards and regulations. This strategic investment in solder paste inspection technology ultimately enhances the production process, offering long-term benefits that include improved product quality, cost efficiency, and competitive advantage in the fast-paced electronics manufacturing sector.
- The Industry's Most Popular True 3D Solder Paste Inspection Solution
KY8030-2
The KY8030-2 has maintained the industry’s leading position as the best-selling True 3D Solder Paste Inspection System since entering the market. Combining Koh Young’s patented 3D dual-inspection Moiré projection technology, it effectively eliminates critical shadow and specular reflection challenges other 3D inspection systems simply cannot address.
Our 3D Inspection Technology is allowing customers the flexibility to improve their manufacturing capabilities and output performance.
With over 20+ years of experience the electronics industry, Koh Young offers our customers a wealth of knowledge and expertise.
We believe in putting our customers first no matter what. Our dedicated team are on hand to provide advice and support.
Inspection Reliability
Koh Young’s inspection systems have become the industry standard. The KY8030-2 features a pioneering True 3D Moiré and dual- direction projection by eliminating shadow and specular reflection challenges without compromising accuracy.
Z-tracking 3D compensation
The unique Koh Young warp compensation technology actively calculates and detects any substrate warpage. Using its exclusive 3D imaging and algorithms , Koh Young considers multiple elements like slope, stretch, twist, bow, and shrinkage to guarantee an accurate measurement and to meet the ultimate inspection system criteria
Auto-Rework
KY8030-2 dispenses solder paste automatically as an optional add-on solution. The high-precision anduser-friendly dispensing system helps eliminate costly mistakes due in large part to insufficient solderin open joints, lean fillets, and weak joints. The automatic dispensing option reduces operational costs,improves line efficiency, and strengthens profitability by eliminating board scrap and rework. OnceKoh Young’s SPI is configured with the Auto-Rework option, it becomes more than an inspection system.It becomes a true process optimizer.
best-selling since launch
The KY8030-2 has held the industry’s leading position as the best-selling True 3D solder paste inspection system since entering the market, and remains the most widely installed of the KY8030 platform.
11.1 to 59.5 cm²/sec
Inspection from 11.1 to 59.5 cm²/sec, at 0.42 seconds per field of view at the fastest setting, with fields of view from 20×20 to 50×50 millimetres and resolutions of 10, 15, 20 or 25 microns. Available in M, L and XL formats.
0.37 micron Z resolution
Z resolution of 0.37 microns and height accuracy of 1 micron, with Gage R&R under 10 percent at 6 sigma against a ±50 percent tolerance. That repeatability is what separates a measurement system from a pass-or-fail check.
dual moiré projection
Patented 3D dual-inspection moiré projection eliminates the shadow and specular reflection challenges other 3D systems cannot address, with active warp compensation across the board.
paste to 450 microns
Volume, area, height, offset, bridging, shape deformity and coplanarity, to a maximum paste height of 450 microns — catching insufficient, excessive and missing paste before placement.
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