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Koh Young Announces the Second Session of its Future Forum Webinar Series Will Focus on Semiconductor & Advanced Packaging Inspection

Faster, Smaller, Denser: Inspecting Semiconductor Packaging." The session is scheduled for 26 May 2022 and will be presented in multiple languages to support our global user base. Anne Kim, Technical Support Professional at Koh Young Technology, will host the online seminar about inspecting challenging semiconductor packages.