Product Overview
About the Meister D Die and Component Inspection System
The Meister D is Koh Young’s production-speed 3D inspection system for dies and small components on high-density substrates, part of the semiconductor metrology range for advanced packaging. Contact us to arrange a consultation.
Down to 0201 Metric
Inspects dies and small components down to 0201 metric, or 008004 inch, using advanced optics with an AI engine and integrated defect analysis software.
Cracks, Chipping and Foreign Material
Detects micro cracks, chipping and foreign material alongside dimensional measurement — the defects that decide whether a package survives its service life.
High-Density Substrates
Built for shiny components and high-density substrate work, including boards with gaps as tight as 50 microns.
Meister D
Meister series has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder and high-density substrates, shiny components, and highly reflective components with full 3D inspection performance.
Overview
In relation to Koh Young Technology, the overview of semiconductor technology highlights the importance of precision, innovation, and quality control in the production of semiconductor devices. Koh Young’s contributions to this field are centered around its advanced inspection and measurement solutions, which are critical for ensuring the integrity and performance of semiconductor components throughout the fabrication process.
FEATURES
Koh Young Technology leverages its expertise in 3D measurement and inspection to address the unique challenges of semiconductor manufacturing. This includes the precise inspection of wafer surfaces, critical dimension measurement, defect detection, and the analysis of complex structures found in semiconductor devices. These capabilities are essential for identifying potential issues early in the manufacturing process, thereby reducing the risk of costly reworks or failures in the final product.
Semiconductor Metrology
Semiconductor packaging has become one of the most dynamic areas of electronics innovation. From system in package (SiP) and chiplet integration to fan out wafer level packaging (FOWLP) and 3D stacked architectures, new designs are demanding extreme precision in assembly and inspection. Deviations in coplanarity, surface contamination, voids in underfill, or tilted dies can jeopardize signal integrity and mechanical reliability. To succeed in this environment, manufacturers need semiconductor metrology and inspection systems that deliver high resolution, high speed, and comprehensive 3D measurement capabilities, capable of analyzing everything from solder bumps to reflective silicon dies. Learn more about Semiconductor Metrology.
applications
Semiconductor Inspection technology is essential across multiple stages of semiconductor device manufacturing, ensuring the functionality and reliability of electronic products. Key applications include wafer inspection for early defect detection, photolithography process control to ensure accurate circuit patterning, and layer thickness and composition analysis for maintaining electrical properties. Critical dimension measurement is crucial for device performance, while defect review and classification inform decisions on wafer processing. Advanced packaging inspection assesses the integrity of complex packaging techniques, and end-of-line quality assurance confirms the device meets all specifications before shipment. By integrating Semiconductor Inspection technology throughout the manufacturing process, companies can minimize failures, improve yield rates, and ensure high-quality performance in their semiconductor devices, meeting the stringent demands of modern electronics.
BENEFITS
The integration of advanced semiconductor inspection technology, as provided by Koh Young, brings significant benefits to the semiconductor manufacturing process. It enhances product quality by ensuring that devices meet stringent standards, thus reducing the likelihood of failures. This technology also increases manufacturing yield by enabling early defect detection and correction, saving materials and contributing to higher profitability. Additionally, it reduces production costs by minimizing the need for rework or scrapping of defective devices, thereby optimizing resource use. Finally, it supports faster time-to-market for new devices by streamlining the manufacturing process and improving efficiency. Overall, Koh Young’s semiconductor inspection technology is pivotal in meeting the demands for quality, reliability, and efficiency in the fast-paced electronics industry.
- Breakthrough in 3D Measurement for High-Density Substrates & Shiny Components and Highly Reflective Components
Meister D
The Meister D is a perfect solution for production-speed 3D inspection for component and die inspection solution targeting die and small MLCCs using an integrated measurement tool with defect analysis software based on advanced optics and AI engines. The system inspects micro cracks, chipping, foreign material, and more.
Our 3D Inspection Technology is allowing customers the flexibility to improve their manufacturing capabilities and output performance.
With over 20+ years of experience the electronics industry, Koh Young offers our customers a wealth of knowledge and expertise.
We believe in putting our customers first no matter what. Our dedicated team are on hand to provide advice and support.
Ai vision
Unparalleled in-house 2D and 3D multi-modal technology combining Moiré technology and new optics enables robust and stable inspection for bleeding-edge applications (such as highly reflective dies and Mini/Micro-LEDs).
With its proprietary deep learning technology, the Meister D/D+ offers enhanced inspection capabilities enabling robust inspection for LED polarity even under harsh production environments such as boards with warp.
Advanced Packaging solutions
The most optimized solution for mass production at major manufacturers of advanced packaging and Mini/Micro-LED applications
Component Inspection
Transports laminates, carriers, strips, boats, and frames.
Powered by AI
Creating a closed-loop, connected electronics manufacturing floor for defect-free production by applying an ever-evolving AI-powered suite of interconnected software modules.
Real-time Koh Young Process Optimizer (KPO)
AI-powered solutions to analyze and optimize the SMT process by examining key parameters generated by state-of-art machine learning technologies.
KPO Printer ensures real-time printing quality without any intervention by an operator or process expert.
KPO Mounter delivers automated root cause analysis and feedback with actionable information.
Koh Young Offline Program Optimizer (OPO)
Cyber-physical system to optimize programs in a simulated environment using the identical machine and actual historical 3D images and measurement data.
Semiconductor Metrology Solutions for Advanced Packaging
Dimensional accuracy, process control, and intelligent feedback are essential pillars of modern semiconductor metrology and inspection.