Product Overview
About the aSPIre 3 SPI System
The aSPIre 3 is Koh Young’s metrology-grade 3D solder paste inspection system, built for lines placing the smallest components where paste volume decides yield. It inspects from 28.2 to 58.5 cm²/sec, or up to 77.9 cm²/sec in the optional two-way configuration. Contact us to arrange a consultation.
Built for 03015M
The aSPIre 3 supports components down to 03015M at 10 or 15 micron resolution, which is where deposit-to-deposit variation stops being visible to a coarser system.
Resolution Sets the Ceiling
The 10 micron configuration measures paste to 300 microns; the 15 micron configuration reaches 450 microns. Resolution and height range are one decision on this machine, not two.
Metrology-Level Output
Z resolution of 0.37 microns, height accuracy of 1 micron and Gage R&R under 10 percent at 6 sigma. The aSPIre 3 also inspects conductive glue and sinter paste alongside ordinary solder paste.
aSPIre 3
The aSPIre3 delivers the highest standard in the Maintenance metrology-level True 3D SPI market, ensuring incomparable performance for the most demanding applications.
Overview
Our 3D solder paste inspection equipment features the world’s leading measurement accuracy and inspection reliability. Accurate measurement data can be secured and the optimization of printing process can be realized through Koh Young’s patented technology that solves shadow and diffuse problems.
FEATURES
Our solder paste inspection equipment sets the gold standard with best-in-class measurement accuracy and inspection reliability, featuring active warp compensation and automated solder paste dispensing with auto-rework capabilities. It’s underpinned by a true 3D measurement-based process control system and leverages AI-powered KPO for zero-defect production, ensuring the highest standard in metrology-level 3D inspection. Going beyond traditional solder paste inspection, it includes self-diagnosis for optimal performance maintenance, marking a new era in precision and efficiency.
solder paste inspection
Solder Paste Inspection (SPI) is a critical process in the manufacturing of printed circuit boards (PCBs) and other electronic assemblies. This process involves the use of specialized equipment to inspect and verify the quality of solder paste application on PCBs before the placement of electronic components. Did you know a majority of printed circuit board (PCB) defects occur during solder printing? Koh Young America’s aSPIre3 system streamlines the solder paste inspection (SPI) process, allowing manufacturers to save time and money without cutting corners.
SOLUTIONS
Our 3D solder paste inspection equipment features the world’s leading measurement accuracy and inspection reliability. Accurate measurement data can be secured and the optimization of printing process can be realized through Koh Young’s patented technology that solves shadow and diffuse problems.
applications
Solder Paste Inspection plays a crucial role across the electronics manufacturing industry, serving as a key process to ensure the quality and reliability of printed circuit boards (PCBs). By meticulously examining the application of solder paste—a critical step in the PCB assembly process—this inspection identifies defects such as insufficient or excessive solder, misalignment, and shape discrepancies. Addressing these issues early in the manufacturing process is essential for preventing potential faults in electronic devices, ranging from consumer electronics to advanced medical equipment and aerospace components. Ultimately, solder paste inspection underpins the assembly’s precision and functionality, contributing significantly to the overall performance and longevity of a wide array of electronic products.
BENEFITS
Investing in solder paste inspection brings a myriad of benefits crucial for the success of electronics manufacturing, encapsulating enhanced product quality and reliability as its core advantage. By identifying and rectifying solder paste application errors early, it ensures that printed circuit boards (PCBs) are less likely to fail, thereby upholding stringent quality standards. This scrutiny not only streamlines the manufacturing process by reducing the necessity for rework and manual inspection but also leads to significant cost savings by minimizing product failures and recalls. Moreover, the assurance of high-quality, reliable products bolsters customer satisfaction and strengthens brand reputation, potentially increasing market share. The scalability of advanced inspection systems accommodates high-volume production needs, ensuring efficiency and adaptability. Additionally, the integration of sophisticated analytics within these systems provides invaluable data for continuous process improvement and innovation, aligning with industry standards and regulations. This strategic investment in solder paste inspection technology ultimately enhances the production process, offering long-term benefits that include improved product quality, cost efficiency, and competitive advantage in the fast-paced electronics manufacturing sector.
- The Industry’s Highest Performing True 3D Solder Paste Inspection Solution
aSPIre 3
The aSPIre3 delivers the highest standard in the Maintenance metrology-level True 3D SPI market, ensuring incomparable performance for the most demanding applications. This inspection system leverages Koh Young’s AI platforms for print process optimization with the award-winning Koh Young Process Optimizer (KPO).
Our 3D Inspection Technology is allowing customers the flexibility to improve their manufacturing capabilities and output performance.
With over 20+ years of experience the electronics industry, Koh Young offers our customers a wealth of knowledge and expertise.
We believe in putting our customers first no matter what. Our dedicated team are on hand to provide advice and support.
Inspection Reliability
Koh Young’s inspection systems have become the industry standard. The KY8030-2 features a pioneering True 3D Moiré and dual- direction projection by eliminating shadow and specular reflection challenges without compromising accuracy.
Z-tracking 3D compensation
The unique Koh Young warp compensation technology actively calculates and detects any substrate warpage. Using its exclusive 3D imaging and algorithms , Koh Young considers multiple elements like slope, stretch, twist, bow, and shrinkage to guarantee an accurate measurement and to meet the ultimate inspection system criteria
Auto-Rework
KY8030-2 dispenses solder paste automatically as an optional add-on solution. The high-precision anduser-friendly dispensing system helps eliminate costly mistakes due in large part to insufficient solderin open joints, lean fillets, and weak joints. The automatic dispensing option reduces operational costs,improves line efficiency, and strengthens profitability by eliminating board scrap and rework. OnceKoh Young’s SPI is configured with the Auto-Rework option, it becomes more than an inspection system.It becomes a true process optimizer.
KSMART Solutions: Koh Young's Smart Factory Solutions
Delivering True 3D Solutions through Award-winning Technology and Relentless Innovation