Koh Young USX Series of Inspection Machines for Ultra Large, Heavy Boards Wins Two Prestigious Awards during SMTA Guadalajara

Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new USX Series of solder paste (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines for ultra large, heavy boards with the coveted Editor’s Choice Award and the Best New SPI Product Award. Mexico EMS Editor Ron Friedman presented both awards to Koh Young during SMTA Guadalajara on 25 October 2023 at the Westin Guadalajara in Jalisco, Mexico.

“PCBs are becoming increasingly complex. Applications like LED, EV, communications, and even storage challenge manufacturers with large, heavy board designs” said Brent Fischthal, Head of Global Marketing at Koh Young Technology. “We developed and designed our new USX Series with manufacturers to help them address these challenges.” With solutions for solder paste, components, and dispensed materials like conformal coating, underfill, and flux, the USX Series handles 1,800mm (70 inch) long boards weighing upwards of 15kg (33lbs), while still delivering all the measurement-based inspection capabilities that made Koh Young the global market leader.

An extension of its award-winning product line-up, the newly introduced USX Series continues to deliver on Koh Young’s promise to deliver critical inspection solutions to eliminate process issues and maximize production quality. Besides increased board handling capabilities, features like active warp compensation, pad-referencing, self-diagnosing maintenance, automated process controls, and foreign material inspection are just some features manufacturers can use to improve yields.

We revolutionized the inspection process years ago with our innovative technology and became the market leader. Today, based on that proven 3D measurement-based technology, Koh Young continues to conquer new manufacturing challenges facing our industry with solutions optimized for extra-long and heavy board applications.

You can explore our solder paste inspection and award-winning True3D inspection solutions at www.kohyoungamerica.com or through these FREE downloads from Koh Young:

About Koh Young Technology, Inc. 

Established in 2002, Koh Young revolutionized the inspection market by launching the industry’s first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True 3D measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and commands the dominant global market share position in the SPI and AOI markets with well over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets by listening to our customers and researching emerging trends and applications. From the headquarters in Korea, activities spread across the world through its global sales and support infrastructure spanning Europe, Asia, and the Americas. These regional offices ensure Koh Young stays close to the market, and more importantly, its growing user base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection for a smart factory at our website kohyoung.com