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Our 3D inspection equipment incorporates advanced technology like multi-direction moiré projection and real-time PCB warp compensation for precision. We also leverage our patented AI platform for process optimization. An integrated auto-repair dispensing system can reapply solder paste before the circuit board leaves the machine.

Using patented True3D technology, the Zenith Series measures true profilometric component shapes up to 25mm tall, plus foreign materials, patterns, solder joints and more with AI-powered capabilities to overcome inspection challenges.

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Conformal coatings isolate and protect electronics, but if the coating is too thin or defective – failure. Koh Young LIFT technology (Laser Interferometry for Fluid Tomography) delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry.

Koh Young America is the leader in 3D automated pin inspection (API) technology across the Americas and beyond. Our products automate back-end inspection by combining advanced high-resolution optics and innovative AI-powered vision algorithms.

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