High-Speed True 3D Inspection Solution for Wafer Bumps

Advanced Packaging & Mini/Micro-LED Applications

Meister series has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder and high-density substrates, shiny components, and highly reflective components with full 3D inspection performance.

Meister W

Meister W

Combining innovative vision algorithms and high-resolution optical technology, the Meister W is the ultimate, True 3D SPI (Solder Paste Inspection) solution for measurement-based wafer bump inspection. Its performance guarantees accurate, repeatable inspection capabilities.

Future Technology

Our 3D Inspection Technology is allowing customers the flexibility to improve their manufacturing capabilities and output performance.


With over 20+ years of experience the electronics industry, Koh Young offers our customers a wealth of knowledge and expertise.

Customer focused

We believe in putting our customers first no matter what. Our dedicated team are on hand to provide advice and support.

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KSMART Solutions: Koh Young's Smart Factory Solutions

Delivering True 3D Solutions through Award-winning Technology and Relentless Innovation