Koh Young 8030 USX SPI for Ultra Large, Heavy Boards Wins the Global Technology Award at Productronica

Atlanta, Georgia – Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced the USX Series of inspection machines for ultra large and heavy boards wins another innovation award. This time, Global SMT & Packaging acknowledged the new 8030 USX SPI, part of the USX series of inspection machines designed for applications like solder paste inspection (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines with the Best New SPI Product Award. Trevor Galbraith, the Publisher of Global SMT presented the award to Koh Young during Productronica on 14 November 2023 at Messe München in Germany.

“Navigating the evolving landscape of PCBs for demanding applications such as LED, electric vehicles, communications, and storage introduce a significant hurdle with the emergence of large, heavy board designs,” explained Brent Fischthal, Head of Global Marketing at Koh Young Technology. “In response, our team engineered and conceptualized the USX Series in close collaboration with manufacturers, providing solutions to effectively tackle these evolving challenges head-on.” With solutions for solder paste (SPI), components and solder joints (AOI), and dispensed materials (DPI/CCI) like conformal coating, underfill, and flux, the USX Series handles 1,800mm (70 inch) long boards weighing upwards of 15kg (33lbs), while still delivering all the fundamental measurement-based inspection capabilities that made Koh Young the global market leader.

As part of its award-winning USX Series line-up, the newly introduced 8030 USX continues to deliver on Koh Young’s promise to deliver critical inspection solutions to eliminate process issues and maximize production quality. Besides increased board handling capabilities, features like active warp compensation, pad-referencing, self-diagnosing maintenance, automated process controls, and foreign material inspection are just some features manufacturers can use to improve yields. 

We revolutionized the inspection process years ago with our innovative technology and became the market leader. Today, based on that proven 3D measurement-based technology, Koh Young continues to conquer new manufacturing challenges facing our industry with solutions optimized for extra-long and heavy board applications.

You can explore our solder paste inspection and award-winning True3D inspection solutions at www.kohyoungamerica.com or through these FREE downloads from Koh Young:

About Koh Young Technology, Inc. 

Established in 2002, Koh Young revolutionized the inspection market by launching the industry’s first 3D Solder Paste Inspection (SPI) system using a patented dual-projection Moiré technology. Since then, it has become the global leader in 3D measurement-based SPI and Automated Optical Inspection (AOI) equipment for the electronics industry. Based on its True 3D measurement-based inspection technology, Koh Young has developed innovative inspection solutions for challenges with machined parts, press-fit and through-hole pins, conformal coatings, dispensed materials, and semiconductor packages. Through its constant innovation, Koh Young has secured over 3,500 global customers, and commands the dominant global market share position in the SPI and AOI markets with well over 20,000 machine installations. By adopting a user-centric R&D focus, it continues to use its core competencies to develop innovative solutions for new and existing markets by listening to our customers and researching emerging trends and applications. From the headquarters in Korea, activities spread across the world through its global sales and support infrastructure spanning Europe, Asia, and the Americas. These regional offices ensure Koh Young stays close to the market, and more importantly, its growing user base. Learn why so many electronics manufacturers trust Koh Young for reliable inspection for a smart factory at our website kohyoung.com