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Essential Inspection Requirements in the Era of Convergence

Scott Kim, Technical Sales Manager, Global Sales Team, Koh Young Technology Brent Fischthal, Senior Manager, Americas Marketing, Koh Young America. In the fast-paced world of electronics manufacturing, the convergence between semiconductor packaging and surface mount technology (SMT) has revolutionized the industry. This merging of technologies has led to the development of innovative, automated optical assembly…

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Master Advanced Packaging Inspection

Ms. Solin Ahmad, Business Operations Manager, Koh Young Europe With increasing customer expectations and demands on electronics equipment, manufacturers are raising their equipment performance requirements. Powerful wearables, Internet of Things (IoT) sensors, mobile communication devices, and new data storage systems push the semiconductor industry and its electronics designers to new heights, which is leading production…

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Small Data, Big Challenges: Journey to realize AI in our Industry

Dr. Brian Kang, Head of AI & SW Development at Koh Young Research America Sarah Chi, Marketing Specialist at Koh Young Technology. AI in the Factory of Future Artificial intelligence (AI) is a multidisciplinary field of science. The goal of AI is to make machines “Smarter.” Historical applications of this goal include natural language processing…

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Koh Young: Getting Equipment In-Line and Customers Online

Koh Young: Getting Equipment In-Line and Customers Online Feature Interview by Nolan Johnson With machine installs somewhere in the range of 500 new annually and award-winning customer and field service, Koh Young has a commanding perspective on the evaluation, purchase, and installation processes for new equipment. We spoke with Mitchell Kim, applications engineer manager; Brent…

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Why the need for 3D Solder Paste Inspection?

Ray Welch, Senior Applications Engineer, Koh Young America, Inc.Brent Fischthal, Senior Marketing Manager, Koh Young America, Inc. People may use the phrase “This is where I am feeling the pain” when describing who and where an issue is causing problems with their board assembly process. Yet, reversing the phrase into a question like “Where do…

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3D Optical Inspection Provides “Eyes” for Process Improvements in Industry 4.0

Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology becomes even more critical. For example, while talking with Janet Tomor, senior business development manager…

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How Engineers Can Use SPI Tools for Verification

Koh Young’s Ray Welch and Brent Fisch- thal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and…

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Smart Factory in Electronics Manufacturing: AI-based Closed-Loop Self-Optimization Platform

Automated production in electronics manufacturing can produce high-quality products, but it might lead to a particular failure without human intervention. With the rapid technology development, such as the Industrial Internet of Things (IIoT), big data analysis, cloud computing, artificial intelligence (AI), many manufacturing processes can be more intelligent, and Industry 4.0 can then be realized…

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Testing out an expert partnership: stencil printing in cavities

Printing in cavities (or trenches) in electronic assemblies is an efficient method of creating more compact electronic circuits. To make this more achievable for manufacturers, four companies (EKRA, Christian Koenen, Heraeus and Koh Young), spanning various branches of the industry, have worked together to develop a reliable and efficient method of solder paste printing in…

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True 3D AOIs to improve your production quality

Abstract 3D Automated Optical Inspection (AOI) systems have become an integral solution for the surface-mount technology (SMT) industry. These systems have become more important for manufacturers, because they provide incomparable reliability to help maintain high quality of boards with thousands of solder joints. However, does this mean every 3D AOI can be the ultimate gatekeeper…

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